PAES for Data Centers and E-Mobility Replacing PEEK and PEI—and Designing PFAS-Free Products

Rising power densities in data centers and electric vehicles are pushing traditional plastics to their thermal limits. By utilizing the graded viscosities of the PAES grades PSU, PESU, and PPSU, developers can design thin-walled connectors and oil-resistant cables more cost-effectively.

Artificial intelligence, cloud applications, and the expansion of high-speed data networks are driving up power density in electronics. At the same time, installation spaces in servers, transformers, and electric vehicles are shrinking, while more and more functions are being packed into increasingly tight spaces. As a result, the thermal, mechanical, and electrical stresses on connectors, cable insulation, and cooling components are increasing significantly.

To manufacture these components reliably and cost-effectively over the long term, BASF is placing greater emphasis on its polyarylethersulfones (PAES) from the Ultrason series into the spotlight of the electrical and electronics industry.

A Cost-Effective Alternative to PEEK, PEI, and PAI

Transparent thermoplastics include the three polymer classes: polysulfone (PSU, Ultrason S), polyethersulfone (PESU, Ultrason E), and polyphenylsulfone (PPSU, Ultrason P). They combine high heat resistance over a wide temperature range with good electrical insulation, high dimensional stability, and inherent flame retardancy.

In addition, these materials offer excellent chemical resistance, allowing them to be used in aggressive media. As a result, these materials are positioned as a cost-effective and easy-to-process alternative to polyetherimide (PEI), polyetheretherketone (PEEK), and polyamideimide (PAI) in demanding electrical and electronic applications.

Graduated Viscosities for Injection Molding and Extrusion

Depending on the manufacturing process and part geometry, BASF offers grades with precisely graded viscosities. High-flow grades reliably fill even complex, thin-walled cavities in injection molding, while higher-viscosity grades provide the melt strength required for demanding extrusion processes. In addition, the plastics can be colored from translucent to opaque, which simplifies the labeling and design of compact assemblies.

“AI infrastructure, high-speed internet, and electrification are driving the development of new E&E components with demanding performance requirements,” explains Kazuhiro Kida from BASF’s Ultrason Business Management team. In addition to material selection, the chemical company supports processors in component design as well as in injection molding and extrusion testing, thereby shortening development cycles.

Thin-walled Fiber-Optic Connectors for Data Centers

Fiber optic connectors (FOC) play a key role in AI data centers. As the packing density in data nodes continues to increase, connector systems such as Lucent Connectors (LC) and Multifiber Push-On (MPO) connectors must accommodate increasingly thin wall thicknesses with tight tolerances.

This is where Ultrason E really shines with its combination of stiffness, toughness, and long-term temperature resistance. Thanks to its high flowability, the PESU reliably fills intricate mold geometries and enables color-coded, mechanically robust connectors.

Oil-resistant cable insulation up to 200 °C, PFAS-free

Significantly higher thermal and chemical stresses are present in data center transformers and in the drive systems of electric vehicles. Polyphenylsulfone Ultrason P is well-suited for these environments; it can be processed via extrusion into cable jackets and insulation for aluminum and copper wires.

The material can withstand hot oil continuously at temperatures up to 200 °C while maintaining its mechanical flexibility and electrical insulation properties. At the same time, the chemical-resistant PPSU replaces polymers based on per- and polyfluorinated alkyl substances (PFAS) that have been used to date in cable jackets and conductor insulation.

Continuous Load in Server and Vehicle Cooling Circuits

As computing and drive power increase, so does the need for high-performance cooling systems. In data centers, electric vehicles, and industrial facilities, water- or fluid-carrying components must withstand high temperatures, chemicals, and mechanical stresses over many years of operation. BASF’s polyarylethersulfones ensure the long-term functionality of fans, pipe fittings, and manifolds in these systems. Because these materials combine temperature and chemical resistance with high dimensional stability, manufacturers can reduce the risk of failure for critical cooling components during continuous operation. (mg)